EDN

CXL Type 3: Tooling and boot path from power-on to usable memory

Part 1 of this min-series established why CXL Type 3 memory expanders matter for capacity-bound workloads and where expander ...
IEEE

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
IEEE

A Novel Double-Sided Cooling Silicon Carbide Power Module With Ultralow Parasitic Inductance Based on an Interleaved Power Loop

Abstract: Higher switching speed requires power module package to have lower parasitic inductance. This article summarized three methods to realize low parasitic inductance. Based on these methods, ...