Abstract: In this article, a time constant of lateral charge loss (LCL) mechanism inside 3-D NAND flash memories during their data retention process is comprehensively investigated. 1-D multiscale ...

Keysight and WIN launch a GaN chip design workflow to reduce tapeout failures and speed RF product development.

Engineers must accurately predict thermal stabilization and calibrate simulation software to achieve consistent quality in ...

Artificial intelligence is rapidly changing how scientists search for new catalysts—the materials that speed up chemical ...

Picture this: a heat exchanger whose internal channels are thinner than a human hair. A rocket combustion chamber with regenerative cooling circuits so intricate they could never be machined. These ...

Return fire! Apply self aid! Get to cover!” screamed a medic assigned to the 3rd Infantry Division as he tried to make his ...

As industrial environments become more complex, immersive simulation and intelligent visualization can help safety teams improve training, communication and emergency preparedness before workers face ...

After the Ansys acquisition, Synopsys is expanding from silicon design into a broader silicon-to-systems engineering platform ...

Increasing complexity in semiconductor manufacturing has pushed the time to market and R&D costs significantly higher. In the world of AI, there is increased focus on efficiency to help address these ...

How do you know anything is real? Some things you can see directly, like your fingers. Other things, like your chin, you need a mirror or a camera to see. Other things can’t be seen, but you believe ...

Abstract: The complex 3D structure of FinFET device has posed new challenges for Physical Failure Analysis (PFA) since its introduction in the 22nm technology node. FinFET process is complicated which ...