UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...
Partron, a global electronics components and sensor company, and Syntiant Corp., a leading provider of full-stack, low-power physical AI solutions comprising sensors, processors and ML models, today ...
KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...
Microchip Technology recently announced the availability of its new 3,3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the adoption of solid-state transformers ...
Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...
Apple's fall announcements will include the iPhone 18 Pro and iPhone Ultra. Here's what to expect from the chip that will ...
Production-ready 3DI technology supports more compact FEMs for advanced 5G devicesMALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production ...
GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...
Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...
Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...
IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...
The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results