Abstract: As a critical component of power modules, silicone gel (SG) insulating encapsulants play a vital role in determining the operational reliability and stability through their long-term ...

Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company ...

Brunson pushed New York across the finish line to win the franchise’s third NBA championship with an all-time great Game 5 performance. Jalen Brunson has always played bigger than his size. On ...

Abstract: This paper presents a 3-D integrated hybrid package using phase change vapor chamber (VC), flexible printed circuit (FPC), direct plating copper (DPC) and diamond. This package improves ...