Abstract: Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, ...
DynPen: Automated Penetration Testing in Dynamic Network Scenarios Using Deep Reinforcement Learning
Abstract: Penetration testing, a crucial industrial practice for securing networked systems and infrastructures, has traditionally depended on the extensive expertise of human professionals.
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