Why thin film patterned substrates are often the foundation for critical electronics in aerospace and defence systems.

Keysight and WIN launch a GaN chip design workflow to reduce tapeout failures and speed RF product development.

Amphenol RF has introduced additional pre-configured MMCX cable assemblies for RF connectivity in industrial wireless systems ...

A compact cable assembly can simplify RF connections between wireless modules and external antennas across industrial systems ...

At its core, a QCM is the hardware interface between classical electronics and quantum hardware. Think of it this way: your qubits exist in a highly controlled cryogenic environment, isolated from ...

One of the most common assumptions PCB designers make when investigating ultra HDI (UHDI) technology is that every layer must be built with ultra-fine geometries using semi-additive processing (SAP) ...

The radio broadcast “air chain” is rapidly evolving from a linear, hardware-defined signal path into a flexible, software-driven ecosystem.

The development of the 6G standard is entering a more concrete phase. At the June 2026 3GPP RAN Plenary in Singapore, the industry advanced several key areas under study and finalized the timeline for ...

To respond to these technology trends, LG Innotek has built a high-value-added semiconductor substrate portfolio that ...

Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...

NISHINOMIYA, HYOGO, JAPAN, June 29, 2026 / EINPresswire.com / — We are delighted to announce that Furuno plans to launch its new GF-100 Series dual-band GNSS Disciplined Oscillators (GNSSDO*1) in ...

Quectel Wireless of Belgrade has  launched a dual band Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 module that is based on the NXP RW612 wireless MCU and supports multiple protocols, including Zigbee ...