UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

Optical interconnects, leveraging intrinsic advantages such as high bandwidth, low loss, and immunity to electromagnetic interference (EMI), are thus regarded as a promising solution to these barriers ...

A leaked iPhone 18 Pro motherboard hints at major A20 chip upgrades, including a new packaging design, better thermal ...

As the global artificial intelligence (AI) boom puts intense pressure on data centre energy grids, some Chinese chipmakers ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...

Explore how onsemi (NASDAQ:ON) expands edge AI capabilities through the Synaptics transaction, strengthening semiconductor ...

The "Smart Power Fab" is one of the world's largest manufacturing plants for power semiconductors, used in power supplies, ...

ON Semiconductor’s shift from a discrete component seller to an integrated physical AI systems leader has captured Wall ...