Section 1. Purpose. The United States continues to lead the world in Artificial Intelligence (AI) because of the enormous talent and innovation of our AI industry, and because we refuse to stifle this ...

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

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Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Forward-looking: Modern data storage has a short lifespan. Hard drives fail, SSDs wear out, and even magnetic tape needs periodic rewriting to avoid degradation. Now, an ambitious technology is aiming ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

When you’ve played video games long enough, you eventually develop something of a “Spidey Sense” when you see a game that seems like it’s going to be extra special. You never know until the final ...

Even the most digital-savvy among us can benefit from using the best planners. An agenda can do more than organize appointments and deadlines—it can boost mental clarity and reduce anxiety (just ask ...

WhatsApp has introduced Advanced Chat Privacy, a feature that builds on its end-to-end encryption to keep your messages as private as possible by keeping chats in the ...

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