IBM just unveiled the world's first sub 1-nanometer chip: 100 billion transistors. IBM also says they've produced functioning ...

MSI Claw 8 EX AI+ benefits from an Intel chip leap finding a performance and frugality balance that was once thought impossible ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

IBM has unveiled what it calls the world’s first sub-1-nanometer chip technology, a 0.7nm (7-angstrom) architecture called ...

Autoblog spoke to Austin Huffman to talk Valvetronic Designs, the electrified future and the future of car culture.

Samsung Electronics has reaffirmed that it will begin mass production of its 1.4-nanometer process in 2029, and unveiled an enhanced SF1.4+ node for 2030, as it works to keep pace with TSMC and Intel ...

Anthropic chip financing deal sees Apollo and Blackstone back a $35bn AI infrastructure push using Broadcom chips.

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

EMUGE-FRANKEN USA announced June 24 the launch of two new chip breaker configurations for its TOP-Cut VAR end mill line. According to a company release, the new chip breakers include unique geometry ...

IBM unveiled a 0.7nm chip built on a new 3D ‘nanostack’ architecture, packing nearly 100 billion transistors onto a fingernail-sized chip.

These are the performance parts that changed hot rodding forever, from Holley carburetors, Hurst shifters, MSD ignitions, and ...

It's mid-2026 — have Samsung's Exynos chips finally caught up to Qualcomm's Snapdragon range? I ran an in-depth gaming test to find out.