Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...

Processing and packaging have long been treated as two different worlds, walled off from each other by the obvious differences in the two functions. However, a growing number of industry professionals ...