When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) ...